IGBT模块银烧结工艺引线键合工艺研究
Research on Silver Sintering Process and Wire Bonding Process of IGBT Module
- 机车电传动 2021年第5期 页码：123-127
- 作者机构：
1.株洲中车时代半导体有限公司，湖南 株洲 412001
2.新型功率半导体器件国家重点实验室，湖南 株洲 412001
- 作者简介：
张浩亮（1994—），男，硕士，主要从事IGBT封装焊接、烧结、超声键合等互连工艺工作；E-mail: zhanghl12@csrzic.com
- 基金信息：
DOI：10.13890/j.issn.1000-128x.2021.05.019
中图分类号：
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张浩亮, 方杰, 徐凝华. IGBT模块银烧结工艺引线键合工艺研究[J]. 机车电传动, 2021,(5):123-127.
Haoliang ZHANG, Jie FANG, Ninghua XU. Research on Silver Sintering Process and Wire Bonding Process of IGBT Module[J]. Electric Drive for Locomotives, 2021,(5):123-127.
张浩亮, 方杰, 徐凝华. IGBT模块银烧结工艺引线键合工艺研究[J]. 机车电传动, 2021,(5):123-127. DOI： 10.13890/j.issn.1000-128x.2021.05.019.
Haoliang ZHANG, Jie FANG, Ninghua XU. Research on Silver Sintering Process and Wire Bonding Process of IGBT Module[J]. Electric Drive for Locomotives, 2021,(5):123-127. DOI： 10.13890/j.issn.1000-128x.2021.05.019.
摘要
主要研究了应用于IGBT模块封装中的银烧结工艺和铜引线键合工艺，依据系列质量表征和评价方法，分别验证并优化了银烧结和铜引线键合的工艺参数，分析了衬板镀层对烧结层和铜线键合界面强度的影响，最后对试制的模块进行浪涌能力和功率循环寿命测试。结果显示，与普通模块相比，搭载银烧结和铜线键合技术的模块浪涌能力和功率循环寿命均有大幅的提升，并且银烧结和铜线键合界面未见明显的退化。
Abstract
The silver sintering process and copper wire bonding process used in IGBT module packaging were studied. Based on a series of quality characterization and evaluation methods, the process parameters of silver sintering and copper wire bonding were verified, optimized and analyzed. The influence of the surface finish coating on the strength of the sintered layer and the bonding interface of the copper wire was analyzed. Finally, the surge capacity and power cycle life of the trial-produced modules were tested. The results showed that the surge capacity and power cycle life of the modules with silver sintering and copper wire bonding technology were greatly improved compared with the ordinary modules, and the interface of silver sintering and copper wire bonding did not degrade obviously.
关键词
银烧结铜线键合可靠性功率循环
Keywords
silver sinteringcopper wire bondingreliabilitypower cycling
references
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