基于热传导模型的IGBT结温计算方法

陈新; 王益民; 王鹏

doi:10.13890/j.issn.1000-128x.2021.05.017

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基于热传导模型的IGBT结温计算方法

应用与测试技术 | 更新时间：2021-12-13

- 基于热传导模型的IGBT结温计算方法
- Calculation Method of IGBT Junction Temperature Based on Heat Conduction Model
- 机车电传动 2021年第5期页码：111-114
- 作者机构：
  
  1.株洲中车时代电气股份有限公司　检测试验中心，湖南　株洲　412001
- 作者简介：
  
  陈新（1986— ），男，硕士，工程师，主要从事环境与可靠性试验工作；E-mail: chenxin3@csrzic.com
- 基金信息：
- DOI：10.13890/j.issn.1000-128x.2021.05.017
  中图分类号：
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陈新, 王益民, 王鹏. 基于热传导模型的IGBT结温计算方法[J]. 机车电传动, 2021,(5):111-114.

Xin CHEN, Yiming WANG, Peng WANG. Calculation Method of IGBT Junction Temperature Based on Heat Conduction Model[J]. Electric Drive for Locomotives, 2021,(5):111-114.
陈新, 王益民, 王鹏. 基于热传导模型的IGBT结温计算方法[J]. 机车电传动, 2021,(5):111-114. DOI： 10.13890/j.issn.1000-128x.2021.05.017.

Xin CHEN, Yiming WANG, Peng WANG. Calculation Method of IGBT Junction Temperature Based on Heat Conduction Model[J]. Electric Drive for Locomotives, 2021,(5):111-114. DOI： 10.13890/j.issn.1000-128x.2021.05.017.

摘要

针对IGBT芯片结温难以直接测量的问题，提出了一种基于热传导模型的IGBT结温计算方法。基于经典的Cauer型RC网络结构，建立了变流器热传导模型；结合传递函数概念和热传导模型结构，完成了变流器热传导模型的参数识别；通过查阅IGBT产品手册以及实际工作工况，计算得到IGBT实时功率损耗；最终通过MATLAB/Simulink进行仿真计算，得到变流器IGBT芯片的实时结温。此方法实现了IGBT芯片结温的快速计算，为IGBT可靠性和寿命评估提供了数据支撑，同时也为功率模块及变流器的设计研发提供了新的科学依据。

Abstract

Aiming at the problem that the junction temperature of IGBT chip is difficult to measure directly, a calculation method of IGBT junction temperature based on heat conduction model was proposed. The heat conduction model of the converter was established based on the classic Cauer RC network structure; the parameter identification of the heat conduction model of the converter was completed by combining the concept of transfer function and the structure of heat conduction model; the real-time power loss of the IGBT was calculated by consulting the IGBT product manual and the actual working conditions; finally, the simulation calculation was carried out by MATLAB/Simulink, and the real-time junction temperature of IGBT chip on the converter was obtained. This method realizes the fast calculation of IGBT chip junction temperature, provides important data support for IGBT reliability and life evaluation, and provides a new scientific basis for the design and development of power modules and converters.

关键词

IGBT芯片热传导模型功率损耗结温计算仿真

Keywords

IGBT chipheat conduction modelpower lossjunction temperature calculationsimulation

references

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毛鹏, 谢少军, 许泽刚. IGBT 模块的开关暂态模型及损耗分析[J]. 中国电机工程学报, 2010, 30(15): 40-47.

MAO Peng, XIE Shaojun, XU Zegang. Switching transients model and loss analysis of IGBT module[J]. Proceedings of the CSEE, 2010, 30(15): 40-47.

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