基于低温烧结银的封装互连方法研究进展

梅云辉; 鲁鑫焱; 杜昆; 张博雯

doi:10.13890/j.issn.1000-128x.2021.05.003

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基于低温烧结银的封装互连方法研究进展

综述 | 更新时间：2021-12-13

- 基于低温烧结银的封装互连方法研究进展
- Research Progress of Package Interconnection Methods Based on Low-Temperature Sintered Silver
- 机车电传动 2021年第5期页码：21-27
- 作者机构：
  
  1.天津工业大学　电气学院，天津　300387
  2.天津工业大学　机械工程学院，天津　300387
  3.广州汉源新材料股份有限公司，广东　广州　510705
- 作者简介：
  
  张博雯（1992—），博士，副教授，主要从事高密度电子封装工艺和关键封装材料研究；E-mail: bowenzhang@tiangong.edu.cn
- 基金信息：
  
  天津市科技计划项目(20JCYBJC00970);国家自然科学基金项目(51922075);国家自然科学基金资助项目(U1966212)
- DOI：10.13890/j.issn.1000-128x.2021.05.003
  中图分类号：
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梅云辉, 鲁鑫焱, 杜昆, 等. 基于低温烧结银的封装互连方法研究进展[J]. 机车电传动, 2021,(5):21-27.

Yunhui MEI, Xinyan LU, Kun DU, et al. Research Progress of Package Interconnection Methods Based on Low-Temperature Sintered Silver[J]. Electric Drive for Locomotives, 2021,(5):21-27.
梅云辉, 鲁鑫焱, 杜昆, 等. 基于低温烧结银的封装互连方法研究进展[J]. 机车电传动, 2021,(5):21-27. DOI： 10.13890/j.issn.1000-128x.2021.05.003.

Yunhui MEI, Xinyan LU, Kun DU, et al. Research Progress of Package Interconnection Methods Based on Low-Temperature Sintered Silver[J]. Electric Drive for Locomotives, 2021,(5):21-27. DOI： 10.13890/j.issn.1000-128x.2021.05.003.

摘要

随着电子电力技术的进步，功率器件朝着高功率密度、高集成度的方向不断发展。互连层作为功率模块热量传输的关键通道，对实现功率模块高温可靠应用具有重要影响。低温烧结银具有工艺温度低、互连强度高、工作温度高、导电性强、导热性强等优异特性，已成为封装互连材料的研究热点。但烧结驱动力需求高、烧结致密度低和“热-机械”应力高等诸多缺陷限制了低温烧结银技术在大面积封装互连领域的广泛应用。文章从材料和工艺角度对现有研究方法和成果进行了归纳总结和比较分析，并在此基础上提出了低温烧结银封装互连技术的研究重点和发展方向，对拓展低温烧结银技术的应用具有重要意义。

Abstract

With the advancement of electronic power technology, power devices are constantly developing towards high power density and high integration. The interconnect layer, as a key channel for heat transfer in power modules, has an important impact on the realization of high-temperature and reliable applications of power modules. Low-temperature sintered silver has become one of the research focus on packaging interconnect materials due to its excellent characteristics such as low process temperature, high interconnect strength, high operating temperature, high electrical conductivity, and high thermal conductivity. However, the high sintering driving force requirement, low sintering density, and high thermal-mechanical stress limit the wide application of low temperature sintered silver technology in the field of large-area package interconnects. The existing research methods and results from the material and process viewpoints were summarized and compared, and the research focus and development direction of low-temperature sintered silver packaging interconnect technology were proposed, which was important for expanding the application of low-temperature sintered silver technology.

关键词

低温烧结银封装互连烧结驱动力烧结致密度热-机械应力

Keywords

low-temperature sintered silverpackage interconnectionsintering driving forcesintering densitythermal-mechanical stress

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