CHEN Hong, YANG Chunyu, LIU Geli, et al. Development of 6 500 V/200 A High-voltage and High-power Localization IGBT[J]. Electric Drive for Locomotives, 2017,(1):1-4.
CHEN Hong, YANG Chunyu, LIU Geli, et al. Development of 6 500 V/200 A High-voltage and High-power Localization IGBT[J]. Electric Drive for Locomotives, 2017,(1):1-4. DOI: 10.13890/j.issn.1000-128x.2017.01.001.
It designed and packed localization IGBT and FRD chip of CRRC. Structural optimization of IGBT was designed through ANSYS simulations of electromagnetic field, heat, stress and so on. The developed IGBT had passed the test of component level, module level, convert level and locomotive class, and satisfy the design requirement. The chip, IGBT, power module to convert industry chain had been formed and successfully used in field of trail transport in China, which has great social signification and market prospect.
关键词
IGBT功率模块封装双脉冲测试优化设计高压大功率ANSYS 仿真
Keywords
IGBTpower modulepackagetest of double pulsesoptimal designhigh-voltage and high-powerANSYS simulation