LIU Xue-quan, YAO Ping-gang, CHEN Xu-hong, et al. Electrical Bonding Analysis and Design for Equipment in Rail Locomotive[J]. Electric Drive for Locomotives, 2014,(3):44-49.
LIU Xue-quan, YAO Ping-gang, CHEN Xu-hong, et al. Electrical Bonding Analysis and Design for Equipment in Rail Locomotive[J]. Electric Drive for Locomotives, 2014,(3):44-49. DOI: 10.13890/j.issn.1000-128x.2014.03.008.
To ensure the reliability and EMC for railway locomotive electric & electronics equipment, electrical bonding principle andbonding resistance were analyzed in detail, and technique factors and implementation requirements affecting bonding were proposed, whichprovides detailed and feasible method and idea for rail locomotive electric & electronics products bonding design.