刘国友, 覃荣震, Ian Deviny, 等. 牵引用3 300 V IGBT/FRD芯片组设计与开发[J]. 机车电传动, 2013,(2):5-8.
LIU Guo-you, QIN Rong-zhen, Ian Deviny, et al. 3 300 V IGBT / FRD Chipset Design and Development for Traction Application[J]. Electric Drive for Locomotives, 2013,(2):5-8.
LIU Guo-you, QIN Rong-zhen, Ian Deviny, et al. 3 300 V IGBT / FRD Chipset Design and Development for Traction Application[J]. Electric Drive for Locomotives, 2013,(2):5-8. DOI: 10.13890/j.issn.1000-128x.2013.02.002.
According to the IGBT characteristics and requirements for traction application, the simulation technique was used on the termination structure design to improve the blocking voltage. The terraced gate structure was developed to increase the switching speed, by adopting the carrier injection efficiency to realize a trade off between on state loss and turn off energy to reduce the total IGBT loss. The advanced cell structure design technique was adopted to optimize the short circuit capability to enhance the reliability. The ’super low P emitter’ was developed to get rid of the local lifetime control to reduce the FRD reverse leakage current. A 3 300 V IGBT/FRD had been developed, which could meet the requirements for traction application.