碳化硅MOSFET基于栅压延时关断方法的结温监测技术研究

周维; 王勇志; 魏晓慧; 郭维立; 何勇

doi:10.13890/j.issn.1000-128X.2023.05.016

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碳化硅MOSFET基于栅压延时关断方法的结温监测技术研究

检测测试技术 | 更新时间：2023-10-12

- 碳化硅MOSFET基于栅压延时关断方法的结温监测技术研究
- Research of SiC MOSFET junction temperature monitoring technology based on gate voltage delayed turn-off method
- 机车电传动 2023年第5期页码：145-151
- 作者机构：
  
  1.湖南国芯半导体科技有限公司，湖南株洲　　412001
  2.株洲中车时代电气股份有限公司，湖南株洲;412001
- 作者简介：
  
  周　维（1984—），男，工程师，研究方向为半导体器件可靠性测试技术和寿命评估；E-mail: zhouwei4@csrzic.com
- 基金信息：
  
  湖南省重点研发计划项目(2022GK2006)
- DOI：10.13890/j.issn.1000-128X.2023.05.016
  中图分类号：
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周维, 王勇志, 魏晓慧, 等. 碳化硅MOSFET基于栅压延时关断方法的结温监测技术研究[J]. 机车电传动, 2023,(5):145-151.

ZHOU Wei, WANG Yongzhi, WEI Xiaohui, et al. Research of SiC MOSFET junction temperature monitoring technology based on gate voltage delayed turn-off method[J]. Electric Drive for Locomotives, 2023,(5):145-151.
周维, 王勇志, 魏晓慧, 等. 碳化硅MOSFET基于栅压延时关断方法的结温监测技术研究[J]. 机车电传动, 2023,(5):145-151. DOI： 10.13890/j.issn.1000-128X.2023.05.016.

ZHOU Wei, WANG Yongzhi, WEI Xiaohui, et al. Research of SiC MOSFET junction temperature monitoring technology based on gate voltage delayed turn-off method[J]. Electric Drive for Locomotives, 2023,(5):145-151. DOI： 10.13890/j.issn.1000-128X.2023.05.016.

摘要

准确监测功率器件结温一直是器件厂商及应用端非常重要的一项工作。主流的温敏电参数法由于响应速度快、测量准确，被广泛地应用于各个领域。目前在硅基器件应用上已相对成熟，然而由于碳化硅器件的高开关特性及栅极氧化层缺陷，采用电参数法会产生更强烈的寄生振荡与高频EMI噪声，这对于测量器件初始温度会带来很大的误差，因此文章提出一种栅压延时关断的改进电参数法测试方案，抑制器件关断阶段的,V,DS,振荡，通过仿真及电路应用验证，以及热阻测试对比分析，验证了这种栅压延时方案能够有效抑制波形振荡，达到准确测量器件结温的目的。

Abstract

Monitoring the junction temperature of power devices accurately is very important for device manufacturers and applications. The mainstream temperature-sensitive electrical parameter method is widely used in various fields because of its fast response speed and accurate measurement. At present, it is relatively mature in silicon-based device applications. However, due to the high switching characteristics of SiC devices and the defects of gate oxide layer, the electrical parameter method generates stronger parasitic oscillation and high frequency EMI noise. This causes large errors in measuring the initial temperature of the device. Therefore, a test scheme based on the improved electrical parameter method for gate time delay was proposed to suppress the ,V,DS, oscillation at the device turn-off moment. Through simulation and circuit application verification, as well as comparative analysis of thermal resistance test, it was proved that this scheme could effectively suppress waveform oscillation and measure the junction temperature of the device accurately.

关键词

栅极电压延时温敏电参数结构函数碳化硅MOSFET热阻

Keywords

gate voltage time delaytemperature-sensitive electrical parametersstructure functionSiC MOSFETthermal resistance

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