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1.重庆大学 电气工程学院,重庆 400044
2.中车永济电机有限公司,山西 永济;044502
赖 伟(1986—),博士,副教授,主要从事电力电子器件可靠性寿命建模和状态监测研究; E-mail: laiweicqu@126.com
纸质出版日期:2022-11-10,
收稿日期:2021-12-07,
修回日期:2022-06-23,
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李涵锐, 赖伟, 李辉, 等. 电力机车服役IGBT模块焊料层空洞演化机理研究[J]. 机车电传动, 2022,(6):138-148.
LI Hanrui, LAI Wei, LI Hui, et al. Research on solder layer void evolution mechanism for IGBT module of electric locomotive in service[J]. Electric drive for locomotives, 2022,(6):138-148.
李涵锐, 赖伟, 李辉, 等. 电力机车服役IGBT模块焊料层空洞演化机理研究[J]. 机车电传动, 2022,(6):138-148. DOI: 10.13890/j.issn.1000-128X.2022.05.107.
LI Hanrui, LAI Wei, LI Hui, et al. Research on solder layer void evolution mechanism for IGBT module of electric locomotive in service[J]. Electric drive for locomotives, 2022,(6):138-148. DOI: 10.13890/j.issn.1000-128X.2022.05.107.
牵引变流器作为电力机车关键部件,通过大功率绝缘栅双极型晶体管(Insulated Gate Bipolar Transistor,IGBT)实现直流能量与交流能量之间的转换,达到对交流牵引电动机启动、制动和调速的控制,其可靠性直接关系电力机车运行安全,而焊料层失效是IGBT模块主要失效模式之一,分析研究焊料层缺陷变化规律对IGBT模块可靠性至关重要。通过对电力机车服役前后的IGBT模块焊料层进行CT扫描,统计结果显示不同服役里程数的IGBT模块焊料层空洞数量服从泊松分布,并且泊松分布方差
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值与器件服役里程数具有映射关系;基于空洞统计分布规律建立了计及初始缺陷的电力机车用IGBT模块多物理场仿真模型,从焊料层上下表面的应变数学描述研究了随机空洞的演化诱因与规律;基于能量的疲劳寿命模型得到了空洞分布、尺寸与演化速率的关系,为指导器件优化设计和主动运维提供支撑。
As a key component of electric locomotives
the traction converter works for the DC to AC energy conversion through a large power insulated gate bipolar transistor (IGBT)
thus exerting control over starting
braking and speed regulation of the AC traction motor. Its reliability is directly related to the operational safety of electric locomotives. Since the solder layer failure is one of the main failure modes of IGBT modules
it is very important to clarify the solder layer defect evolution law
for the sake of reliability of IGBT modules. In this paper
the solder layer of an IGBT module was firstly scanned by CT before and after putting into service of the electric locomotive. The statistical results showed that the number of solder layer voids in the IGBT module with different service mileages was in line with the Poisson distribution
of which the variance (λ) had a mapping relationship with the service mileage of the devices. Secondly
a multi-physical field simulation model of IGBT modules for electric locomotives was established
based on the statistical distribution law of voids and considering the initial defects
and the evolution inducements and law of random voids were studied by means of the strain mathematical description on the upper and lower surfaces of the solder layer. Finally
the relationship among void distribution
size and evolution rate was generated according to the energy-based fatigue lifetime model
which provided a basis for guiding optimal design and active maintenance of the devices.
大功率IGBT模块空洞分布空洞演化多物理场有限元仿真电力机车
high power IGBT modulevoid distributionvoid evolutionmulti-physical field finite element simulation electric locomotive
林双双. 基于信号处理的牵引逆变器IGBT的故障诊断方法研究[D]. 成都: 西南交通大学, 2018.
LIN Shuangshuang. Fault diagnosis of IGBT based on signal processing methods in traction inverter system[D]. Chengdu: Southwest Jiaotong University, 2018.
陶宣彤. 大功率电力机车牵引变流器故障诊断与寿命预测[D]. 成都: 西南交通大学, 2018.
TAO Xuantong. Fault diagnosis and remaining-life prediction of traction converter for high power electric locomotive[D]. Chengdu: Southwest Jiaotong University, 2018.
徐玲, 周洋, 张泽峰, 等. IGBT模块焊料层空洞对模块温度影响的研究[J]. 中国电子科学研究院学报, 2014, 9(2): 125-129.
XU Ling, ZHOU Yang, ZHANG Zefeng, et al. Influence of solder void to thermal distribution of IGBT module[J]. Journal of China Academy of Electronics and Information Technology, 2014, 9(2): 125-129.
吴煜东, 常桂钦, 彭勇殿, 等. 焊层空洞对IGBT模块热应力的影响[J]. 大功率变流技术, 2014(1): 17-23.
WU Yudong, CHANG Guiqin, PENG Yongdian, et al. Effect of solder voids on IGBT thermal and stress performance[J]. High Power Converter Technology, 2014(1): 17-23.
江南. 计及疲劳累积效应的IGBT模块焊料层失效机理及疲劳损伤研究[D]. 重庆: 重庆大学, 2016.
JIANG Nan. Study on failure mechanism and fatigue damage of the solder layer in the IGBT module considering cumulative damage[D]. Chongqing: Chongqing University, 2016.
肖飞, 罗毅飞, 刘宾礼, 等. 焊料层空洞对IGBT器件热稳定性的影响[J]. 高电压技术, 2018, 44(5): 1499-1506.
XIAO Fei, LUO Yifei, LIU Binli, et al. Influence of voids in solder layer on the temperature stability of IGBTs[J]. High Voltage Engineering, 2018, 44(5): 1499-1506.
DU Mingxing, GUO Qiuya, WANG Hongbin, et al. An improved cauer model of IGBT module: inclusive void fraction in solder layer[J]. IEEE Transactions on Components Packaging and Manufacturing Technology, 2020, 10(8): 1401-1410.
唐圣学, 马强, 陈冬, 等. IGBT模块焊料层空洞生长分析与评估方法[J]. 仪器仪表学报, 2020, 41(8): 244-254.
TANG Shengxue, MA Qiang, CHEN Dong, et al. IGBT module solder layer void growth analysis and evaluation method[J]. Chinese Journal of Scientific Instrument, 2020, 41(8): 244-254.
HU Borong, KONAKLIEVA S, KOURRA N. Long-term reliability evaluation of power modules with low amplitude thermomechanical stresses and initial defects[J]. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2021, 9(1): 602-615.
郑钢涛, 陈素鹏, 胡俊, 等. 焊料层空洞面积对功率器件电阻和热阻的影响[J]. 半导体技术, 2010, 35(11): 1059-1063.
ZHENG Gangtao, CHEN Supeng, HU Jun, et al. Effects of void area in solder layer on resistance and thermal impedance of power devices[J]. Semiconductor Technology, 2010, 35(11): 1059-1063.
JIA Yingjie, HUANG Yongle, XIAO Fei, et al. Impact of solder degradation on VCE of IGBT module: experiments and modeling[J]. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2022, 10(4): 4536-4545.
SYED A. Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints[C]//IEEE. 54th Electronic Components and Technology Conference. Las Vegas: IEEE, 2004: 737-746.
ABUELNAGA A, NARIMANI M, BAHMAN A S. A Review on IGBT module failure modes and lifetime testing[J]. IEEE Access, 2021, 9: 9643-9663.
方鑫, 周雒维, 姚丹, 等. IGBT模块寿命预测模型综述[J]. 电源学报, 2014(3): 14-21.
FANG Xin, ZHOU Luowei, YAO Dan, et al. An overview of IGBT life prediction models[J]. Journal of Power Supply, 2014(3): 14-21.
LAI Wei, CHEN Minyou, RAN Li, et al. Experimental investigation on the effects of narrow junction temperature cycles on die-attach solder layer in an IGBT module[J]. IEEE Transactions on Power Electronics, 2017, 32(2): 1431-1441.
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