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Thermal resistance research of power devices based on structural function curve correction method
High-power Devices | 更新时间：2025-06-29

    • Thermal resistance research of power devices based on structural function curve correction method

    • “In the field of thermal resistance testing for power devices, researchers conducted thermal resistance testing on IGBT modules, obtained structural function curves, and verified the degradation range of thermal resistance before and after the experiment, providing a new direction for thermal resistance research of power devices.”
    • Electric Drive for Locomotives   Issue 2, Pages: 163-169(2025)

    • DOI：10.13890/j.issn.1000-128X.2025.02.103    

      CLC： U264.3+7

    • Received：11 October 2024，

      Revised：27 December 2024，

      Published：10 March 2025

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  • WANG Yongzhi, ZHOU Wei, WEI Xiaohui, et al. Thermal resistance research of power devices based on structural function curve correction method[J]. Electric drive for locomotives,2025(2): 163-169. DOI：10.13890/j.issn.1000-128X.2025.02.103.

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Related Author

ZHOU Wei
WANG Yongzhi
WEI Xiaohui
GUO Weili
HE Yong
Kai HE
Xingzhi WANG
En TIAN

Related Institution

CRRC Zhuzhou Institute Co., Ltd.
Zhengzhou Research Institute of Mechanical Engineering
School of Electrical Engineering, Southwest Jiaotong University
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