Design and Implementation of Comparative Accelerated Life Test for Solder Joints Based on Failure Mechanism

Fan YANG

doi:10.13890/j.issn.1000-128x.2020.03.031

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Design and Implementation of Comparative Accelerated Life Test for Solder Joints Based on Failure Mechanism

更新时间：2021-12-10

- Design and Implementation of Comparative Accelerated Life Test for Solder Joints Based on Failure Mechanism
- Electric Drive for Locomotives Issue 3, Pages: 148-152(2020)
- 作者机构：
  
  1.中国国家铁路集团有限公司，北京　100844
- 作者简介：
- 基金信息：
- DOI：10.13890/j.issn.1000-128x.2020.03.031
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Fan YANG. Design and Implementation of Comparative Accelerated Life Test for Solder Joints Based on Failure Mechanism. [J]. Electric Drive for Locomotives (3):148-152(2020)
DOI：

Fan YANG. Design and Implementation of Comparative Accelerated Life Test for Solder Joints Based on Failure Mechanism. [J]. Electric Drive for Locomotives (3):148-152(2020) DOI： 10.13890/j.issn.1000-128x.2020.03.031.

摘要

为解决传统加速寿命试验存在的试验时间过长、样本量大的缺点，需要设计对比加速寿命试验。首先通过分析通孔焊点失效的故障原理，明确失效敏感应力；然后基于前期统计信息和失效敏感应力，设计对比加速寿命试验方案；最后针对基准插件通孔焊点实施对比加速寿命试验，并验证了待评估插件通孔焊点的寿命水平。结果表明，相对于传统的加速寿命试验，对比加速寿命试验所需试验时间短、样本量较少，并参考基准插件通孔焊点的寿命基准，验证了待评估插件通孔焊点的寿命不足10年，需要进行工艺改进。

Abstract

In order to solve the shortcomings of traditional accelerated life test, such as long test time and large sample size, it is necessary to design comparative accelerated life test. Firstly, through the analysis of the failure mechanism of through-hole solder joints, the failure sensitive stress was defined; Secondly, based on the previous statistical information and the failure sensitive stress, the comparative accelerated life test scheme was designed; Finally, the comparative accelerated life test was carried out for the reference plug-in through-hole solder joints, and the life level of the through-hole solder joints to be evaluated was verified. The results showed that compared with the traditional accelerated life test, the comparative accelerated life test required shortened test time and fewer samples. Referring to the life benchmark of reference plug-in through-hole solder joints, it was verified that the life of the evaluated plug-in through-hole solder joints was less than 10 years, and the process improvement was needed.

关键词

通孔焊点对比加速寿命试验故障物理寿命基准应力可靠性

Keywords

through-hole solder jointcomparative accelerated life testfailure mechanismlife benchmarkstressreliability

references

陈颖, 高蕾, 康锐. 基于故障物理的电子产品可靠性仿真分析方法[J]. 中国电子科学研究院学报, 2013, 8(5): 444-448.

佟川, 曾声奎, 陈云霞. 塑封球栅阵列焊点热疲劳寿命预测有限元方法[J]. 焊接学报, 2007, 28(10): 89-92.

张鹿皓, 谢劲松. 基于失效物理方法的焊点疲劳寿命评价流程设计[J]. 电子质量, 2014 (8): 23-27.

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QI H Y, OSTERMAN M, PECHT M. A rapid life-prediction approach for PBGA solder joints under combined thermal cycling and vibration loading conditions[J]. IEEE Transactions on Components and Packaging Technologies, 2009, 32(2): 283-292.

The SMT Attachment Reliability Test Methods Task Group(6-10d) of the Product and Reliability Committee (6-10) of IPC. Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments: IPC 9701A[S]. 2006.

王文. SMT无铅焊点在随机振动载荷下的可靠性分析[D]. 上海: 上海交通大学, 2014.

全国牵引电气设备与系统标准化技术委员会. 轨道交通机车车辆设备冲击和振动试验：GB/T 21563—2008[S]. 北京: 中国标准出版社, 2008.

The IPC-A-610 Task Group (7-31b) of the Acceptability Subcommittee (7-31) of the Product Assurance Committee (7-30) of IPC. Acceptability of Electronic Assemblies: IPC-A-610D[S]. 2005.

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