Power Cycling Capability and Reliability Test of IGBT Modules

LI Shiping; HUANG Rong; FENG Qin; WAN Chaoqun; CHEN Yan

doi:10.13890/j.issn.1000-128x.2015.03.004

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Power Cycling Capability and Reliability Test of IGBT Modules

更新时间：2021-12-13

- Power Cycling Capability and Reliability Test of IGBT Modules
- Electric Drive for Locomotives Issue 3, Pages: 15-18(2015)
- 作者机构：
  
  1. 株洲南车时代电气股份有限公司半导体事业部,湖南,株洲,412001
- 作者简介：
- 基金信息：
- DOI：10.13890/j.issn.1000-128x.2015.03.004
  CLC：
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LI Shiping, HUANG Rong, FENG Qin, et al. Power Cycling Capability and Reliability Test of IGBT Modules. [J]. Electric Drive for Locomotives (3):15-18(2015)
DOI：

LI Shiping, HUANG Rong, FENG Qin, et al. Power Cycling Capability and Reliability Test of IGBT Modules. [J]. Electric Drive for Locomotives (3):15-18(2015) DOI： 10.13890/j.issn.1000-128x.2015.03.004.

摘要

为验证IGBT 模块的可靠性，分析了IGBT 模块的封装结构，并在传统IGBT 模块功率循环试验的基础上建立新的模型，通过具体的试验得到IGBT 模块功率循环后失效状况，并对该状况进行分析。相对传统IGBT寿命预测和可靠性评估，该功率循环的新方法更加贴合实际应用工况，对IGBT 失效分析具有借鉴作用。

Abstract

In order to examine the reliability of IGBT modules , IGBT package structure was analyzed and a new model of powercycling was proposed based on the traditional method. Tests were performed on IGBT modules by power cycling and the failed situationwas shown. Compared to traditional life prediction and reliability evaluation of IGBT, the new power cycling method proposed in thispaper is more closer to the actual application and also more useful to IGBT failure analysis.

关键词

IGBT 模块封装结构失效功率循环模块性能可靠性试验

Keywords

IGBT modulepackage structurefailurepower cyclingmodule performancereliability test

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