Study of Thermal Characteristics on Press-pack IGBT Modules

DOU Ze-chun; XIN Lan-yuan; LIU Guo-you; HUANG Rong; XU Ning-hua; WU Yi-bo

doi:10.13890/j.issn.1000-128x.2013.03.002

您当前的位置：

首页 >

文章列表页 >

Study of Thermal Characteristics on Press-pack IGBT Modules

更新时间：2021-12-13

- Study of Thermal Characteristics on Press-pack IGBT Modules
- Electric Drive for Locomotives Issue 3, Pages: 6-9(2013)
- 作者机构：
  
  1. 株洲南车时代电气股份有限公司功率半导体研发中心
  2. 株洲南车时代电气股份有限公司
- 作者简介：
- 基金信息：
- DOI：10.13890/j.issn.1000-128x.2013.03.002
  CLC：
扫描看全文
DOU Ze-chun, XIN Lan-yuan, LIU Guo-you, et al. Study of Thermal Characteristics on Press-pack IGBT Modules. [J]. Electric Drive for Locomotives (3):6-9(2013)
DOI：

DOU Ze-chun, XIN Lan-yuan, LIU Guo-you, et al. Study of Thermal Characteristics on Press-pack IGBT Modules. [J]. Electric Drive for Locomotives (3):6-9(2013) DOI： 10.13890/j.issn.1000-128x.2013.03.002.

摘要

使用3种方法研究了压接式IGBT模块的热学特性，建立模块热学模型并通过数值计算和有限元仿真的方法分析其稳态热阻特性，搭建实物测试台，通过温度参数定标等方式间接测量模块热阻特性，最后对采用3种方法的结果进行了分析比较。

Abstract

Thermal characteristics of press-pack IGBT modules were studied by utilizing three kinds of approaches. The thermal model was constructed, and static thermal resistance was analyzed by computation and finite-element simulation, as well as experimental measuring approach was applied based on the calibration of temperature parameters. Result based above three methods were analyzed and compared.

关键词

压接式IGBT 模块热学特性计算试验有限元仿真

Keywords

press-pack IGBT modulethermal characteristicscomputationexperimentationFE simulation

references

Views

下载量

CSCD

CNKI被引量

Alert me when the article has been cited

提交

Tools

Publicity Resources

No data

Related Author

No data

Related Institution

No data

⁰