Thermal Design and Simulation of 1 500 A/3 300 V IGBT Power Modulein Traction Applications

LIU Guo-you; WU Yi-bo; XU Ning-hua; DOU Ze-chun

doi:10.13890/j.issn.1000-128x.2013.01.002

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Thermal Design and Simulation of 1 500 A/3 300 V IGBT Power Modulein Traction Applications

更新时间：2021-12-13

- Thermal Design and Simulation of 1 500 A/3 300 V IGBT Power Modulein Traction Applications
- Electric Drive for Locomotives Issue 1, Pages: 1-4(2013)
- 作者机构：
  
  1. 株洲南车时代电气股份有限公司功率半导体研发中心
- 作者简介：
- 基金信息：
- DOI：10.13890/j.issn.1000-128x.2013.01.002
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LIU Guo-you, WU Yi-bo, XU Ning-hua, et al. Thermal Design and Simulation of 1 500 A/3 300 V IGBT Power Modulein Traction Applications. [J]. Electric Drive for Locomotives (1):1-4(2013)
DOI：

LIU Guo-you, WU Yi-bo, XU Ning-hua, et al. Thermal Design and Simulation of 1 500 A/3 300 V IGBT Power Modulein Traction Applications. [J]. Electric Drive for Locomotives (1):1-4(2013) DOI： 10.13890/j.issn.1000-128x.2013.01.002.

摘要

主要针对牵引级1 500 A/3 300 V IGBT 模块进行热学分析，建立了基于热节点网络的热阻等效电路模型，从理论上优化了功率模块的稳态热阻分布，通过有限元模型对1 500 A/3 300 V IGBT模块进行热学仿真设计，验证了该热阻模型的有效性。

Abstract

The thermal management of 1 500 A/3 300 V IGBT power module was developed in this paper. First, based on thermal nodes network, an equivalent circuit model for thermal resistance of power module was highlighted, from which the steady state thermal resistance was optimized theoretically. Then, thermal simulation of 1 500 A/3 300 V IGBT module was accomplished by means of finite element model (FEM). Finally, the thermal equivalent model of the IGBT module was verified by simulation results.

关键词

功率模块IGBT热阻分析节点模型

Keywords

power moduleIGBTthermal resistance analysisnode model

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Shanghai CNR Yongdian Electronics Technology Inc.

Technology Center, CRRC Yongji Electric Co., Ltd.

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