Research on the influence of epoxy resin on the service life of bond wire in power devices

HUA Wenbo; DENG Erping; LIU Peng; NIU Hao; YANG Shaohua; DING Lijian

doi:10.13890/j.issn.1000-128X.2023.05.009

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Research on the influence of epoxy resin on the service life of bond wire in power devices

Packaging Technology | 更新时间：2023-10-12

- Research on the influence of epoxy resin on the service life of bond wire in power devices
- Electric Drive for Locomotives Issue 5, Pages: 92-100(2023)
- 作者机构：
  
  1.合肥工业大学电能高效高质转化全国重点实验室，安徽合肥　　230009
  2.合肥综合性国家科学中心能源研究院，安徽合肥　　230051
  3.华北电力大学新能源电力系统全国重点实验室，北京　　102206
  4.工业和信息化部电子第五研究所电子元器件可靠性物理及其应用技术重点实验室，广东;广州 511370
- 作者简介：
- 基金信息：
- DOI：10.13890/j.issn.1000-128X.2023.05.009
  CLC：
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HUA Wenbo, DENG Erping, LIU Peng, et al. Research on the influence of epoxy resin on the service life of bond wire in power devices. [J]. Electric Drive for Locomotives (5):92-100(2023)
DOI：

HUA Wenbo, DENG Erping, LIU Peng, et al. Research on the influence of epoxy resin on the service life of bond wire in power devices. [J]. Electric Drive for Locomotives (5):92-100(2023) DOI： 10.13890/j.issn.1000-128X.2023.05.009.

摘要

功率循环测试是考核功率半导体器件封装可靠性最重要的可靠性测试。键合线失效约占功率循环失效模式的70%。TO（Transistor Outline，晶体管外形）器件采用环氧树脂进行封装，在相同的条件下，因为高弹性模量被证明比硅胶具有高约3倍的功率循环寿命，后被广泛应用到电动汽车的双面散热半桥功率模块，但环氧树脂在高温情况下性能并不稳定，进而影响键合线寿命。为充分了解环氧树脂对功率器件键合线寿命的影响规律，文章首先通过功率循环测试分析了两种不同玻璃化转化温度(Glass transition temperature,T,g,),的环氧树脂功率器件在同一条件下的寿命，发现更高的,T,g,可以有效抑制键合线的抬起并提高其寿命；然后针对试验用的1 200 V、25 A的TO器件，基于COMSOL仿真软件建立电-热-应力多物理场耦合有限元模型，探究环氧树脂在达到玻璃转化温度,T,g,前后不同的热膨胀系数以及环氧树脂不同的厚度参数对键合线应力应变的影响，并结合疲劳模型预测键合线寿命；最后通过线性回归拟合对仿真参变量进行定量分析，为功率器件环氧树脂塑封材料的设计优化和可靠性提升提供参考。

Abstract

Power cycling test is the most important test to evaluate the package reliability of power semiconductor devices. Bonding wire failure accounts for approximately 70% of power cycle failure modes. It has been proved that the TO (Transistor Outline) device packaged with epoxy resin has a power cycle life about 3 times higher than the device packaged with silica gel under same conditions because of its high elastic modulus. Therefore, it is widely used in double-sided heat dissipation half-bridge power modules of electric vehicles. However, the unstable performance of epoxy resin at high temperature affects the service life of bonding wire. In order to fully understand the influence of epoxy resin on the service life of power device bonding wire, this paper first used power cycle test to analyze the service life performance of epoxy resin power devices at two different glass transition temperatures (,T,g,) with other conditions kept the same, and the test found out that higher ,T,g, can effectively curb the lifting of bonding wires and improve the service life of devices. Then, for the 1 200 V, 25 A TO devices used in the experiment, a coupled finite element model of electrical-thermal-stress multiphysics was established using COMSOL simulation software to explore the different thermal expansion coefficients before and after the glass transition temperature (,T,g,) of epoxy resin and the influence of different thickness parameters of epoxy resin on the stress strain of bonding wire, and the service life of bonding wire was predicted by combining the fatigue model. Finally, this paper quantified the simulation parameters by linear regression fitting, which provided references for the design optimization and reliability improvement of epoxy resin packaging materials used for power devices.

关键词

功率循环键合线环氧树脂玻璃化转化温度COMSOL

Keywords

power cyclingbonding wireepoxy resinglass transition temperatureCOMSOL

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