Intelligent integrated power device with high power density and research on its parallel application

JIN Jiange; YANG Jinfeng; WANG Xiaoyuan; LIU Jie; SONG Guomeng; MA Longchang

doi:10.13890/j.issn.1000-128X.2023.04.020

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Intelligent integrated power device with high power density and research on its parallel application

High-power Devices | 更新时间：2024-08-02

- Intelligent integrated power device with high power density and research on its parallel application
- Electric Drive for Locomotives Issue 4, Pages: 145-151(2023)
- 作者机构：
  
  中车株洲电力机车研究所有限公司，湖南株洲 412001
- 作者简介：
- 基金信息：
- DOI：10.13890/j.issn.1000-128X.2023.04.020
  CLC： TN303;TM46
- Published：10 July 2023，
  
  Received：06 April 2023，
  
  Revised：26 June 2023，
- 稿件说明：
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金肩舸, 杨进锋, 王晓元, 等. 高功率密度智能化集成功率器件及其并联应用研究[J]. 机车电传动, 2023(4): 145-151.

JIN Jiange, YANG Jinfeng, WANG Xiaoyuan, et al. Intelligent integrated power device with high power density and research on its parallel application[J]. Electric drive for locomotives,2023(4): 145-151.
金肩舸, 杨进锋, 王晓元, 等. 高功率密度智能化集成功率器件及其并联应用研究[J]. 机车电传动, 2023(4): 145-151. DOI： 10.13890/j.issn.1000-128X.2023.04.020.

JIN Jiange, YANG Jinfeng, WANG Xiaoyuan, et al. Intelligent integrated power device with high power density and research on its parallel application[J]. Electric drive for locomotives,2023(4): 145-151. DOI： 10.13890/j.issn.1000-128X.2023.04.020.

摘要

为突破传统功率半导体器件的封装和应用结构限制，实现变流装备的升级换代，文章提出了一种新型的高功率密度智能化集成功率器件。为验证该技术路线的可行性，以大功率变流领域内常见的并联应用场景作为研究对象，从器件参数、主电路、散热结构、驱动控制等4个主要影响因素着手，分析并验证了其良好的器件匹配性、电感均衡度、散热均温性、控制信号同步性、抗干扰能力，最后通过双脉冲试验和功率考核试验，证明了其良好的并联均流效果。试验结果表明，该技术平台从理论设计到实物验证的目标可以得到实现，具备了工程应用基础。

Abstract

To overcome the limitations on the packaging and application structure of traditional power semiconductor devices and upgrade converters

this paper proposed a novel intelligent integrated power device with high power density. Its feasibility was investigated by focusing on common parallel application scenarios in the high-power converter field. The study primarily examined the four key influencing factors: device parameters

main circuit

heat dissipation structure

and drive control. It analyzed and validated the excellent device matching

inductance balance

heat dissipation uniformity

control signal synchronization

and anti-interference capability. Subsequently

the article demonstrated the favorable parallel current sharing effect through the double pulse test and power assessment test. The experimental results show the achievement of the theoretical design and physical verification objectives of this technology platform

establishing a strong foundation for future engineering applications.

关键词

大功率高压集成化智能化IGBTIPM并联均流

Keywords

high powerhigh voltageintegrationintelligentIGBTIPMparalleled current sharing

references

SHAMMAS N Y A, WITHANAGE R, CHAMUND D. Review of series and parallel connection of IGBTs[J]. IEE proceedings - Circuits, devices and systems, 2006, 153(1): 34-39.

祁善军, 翁星方, 宋文娟, 等. 大功率IGBT模块并联均流特性研究[J]. 大功率变流技术, 2011(6): 10-14.

QI Shanjun, WENG Xingfang, SONG Wenjuan, et al. Research on even flow of high-power IGBT module in parallel[J]. High power converter technology, 2011(6): 10-14.

凌晨, 胡安, 唐勇. IGBT并联动态不均流温度特性研究[J]. 电力电子技术, 2011, 45(11): 121-123.

LING Chen, HU An, TANG Yong. Research on temperature characteristic of IGBT parallel connection dynamic current imbalance[J]. Power electronics, 2011, 45(11): 121-123.

李华, 杨光, 杨涛, 等. 6.5 kV高压IGBT的并联应用研究[J]. 机车电传动, 2011(4): 14-16.

LI Hua, YANG Guang, YANG Tao, et al. Application research on parallel-using of 6.5 kV high-voltage IGBT[J]. Electric drive for locomotives, 2011(4): 14-16.

忻兰苑, 孙康康, 龚喆, 等. 功率组件IGBT并联均流设计[J]. 大功率变流技术, 2017(1): 18-23.

XIN Lanyuan, SUN Kangkang, GONG Zhe, et al. Current balancing design of paralleled-IGBT in power assembly[J]. High power converter technology, 2017(1): 18-23.

LETOR R. Static and dynamic behavior of paralleled IGBTs[J]. IEEE transactions on industry applications, 1992, 28(2): 395-402.

丁荣军, 窦泽春, 罗海辉. 高压大容量功率半导体器件技术及其应用[J]. 机车电传动, 2023(2): 1-13.

DING Rongjun, DOU Zechun, LUO Haihui. Technology and application of high-voltage and large-capacity power semiconductor devices[J]. Electric drive for locomotives, 2023(2): 1-13.

王位, 李卫超, 林城美. 大容量IGBT并联均流检测技术研究[J]. 电气传动, 2017, 47(6): 71-76.

WANG Wei, LI Weichao, LIN Chengmei. Research on detection method for current balancing of parallel connected high power IGBT modules[J]. Electric drive, 2017, 47(6): 71-76.

张晋芳, 梁海刚, 刘志敏. 4 500 V高压大电流IGBT并联应用研究[J]. 铁道机车与动车, 2014(6): 6-8.

ZHANG Jinfang, LIANG Haigang, LIU Zhimin. Research on parallel application of 4 500 V high voltage and high current IGBT[J]. Railway locomotive and motor car, 2014(6): 6-8.

福尔克, 郝康普. IGBT模块: 技术、驱动和应用[M]. 韩金刚, 译. 北京: 机械工业出版社, 2016: 247-261.

VOLKE A, HORNKAMP M. IGBT modules: technologies, driver and application[M]. HAN Jingang, translated. Beijing: China Machine Press, 2016: 247-261.

吴建雄, 张洪浩, 陈艺峰. 多IGBT并联模块的交直流母排设计研究[J]. 大功率变流技术, 2017(2): 27-32.

WU Jianxiong, ZHANG Honghao, CHEN Yifeng. Study of DC bus-bar and AC bus-bar design for multi paralleled-IGBT module[J]. High power converter technology, 2017(2): 27-32.

杨笑宇, 刘伟增, 马超群, 等. 交流铜排结构对功率模块并联均流的影响[J]. 电力电子技术, 2013, 47(5): 100-103.

YANG Xiaoyu, LIU Weizeng, MA Chaoqun, et al. Influence of AC copper bar structure on current sharing of paralleled IGBT modules[J]. Power electronics, 2013, 47(5): 100-103.

王雪松, 赵争鸣, 袁立强, 等. 应用于大容量变换器的IGBT并联技术[J]. 电工技术学报, 2012, 27(10): 155-162.

WANG Xuesong, ZHAO Zhengming, YUAN Liqiang, et al. Parallel technique for IGBT modules applied in high-power converter[J]. Transactions of China electrotechnical society, 2012, 27(10): 155-162.

本达, 戈沃, 格兰特. 功率半导体器件——理论及应用[M]. 吴郁, 张万荣, 刘兴明, 译. 北京: 化学工业出版社, 2005: 257.

BENDA V, GOWAR J, GRANT D A. Power semiconductor devices: theory and applications[M]. WU Yu, ZHANG Wanrong, LIU Xingming, translated. Beijing: Chemical Industry Press, 2005: 257.

马伯乐, 杨光, 忻力. 大功率IGBT直接并联应用技术研究[J]. 机车电传动, 2014(1): 11-15.

MA Bole, YANG Guang, XIN Li. Application research on parallel using of high-power IGBT[J]. Electric drive for locomotives, 2014(1): 11-15.

马龙昌, 张东辉, 杨光, 等. IGBT并联应用技术研究[J]. 大功率变流技术, 2015(2): 35-39.

MA Longchang, ZHANG Donghui, YANG Guang, et al. Research on the IGBT paralleling application[J]. High power converter technology, 2015(2): 35-39.

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