您当前的位置:
首页 >
文章列表页 >
Application review of IGBT power module cooling system
High-power Devices | 更新时间:2024-08-02
    • Application review of IGBT power module cooling system

    • Electric drive for locomotives   Issue 6, Pages: 130-137(2022)
    • DOI:10.13890/j.issn.1000-128X.2022.06.019    

      CLC: TK121;TN325+.2
    • Published:10 November 2022

      Received:27 April 2022

      Revised:01 September 2022

    扫 描 看 全 文

  • WANG Weilong, XIANG Liping, ZHAO Guangpan. Application review of IGBT power module cooling system. [J]. Electric drive for locomotives (6):130-137(2022) DOI: 10.13890/j.issn.1000-128X.2022.06.019.

  •  
  •  

0

Views

56

下载量

0

CSCD

3

CNKI被引量

>
Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

A simplified junction temperature curve calculation method for IGBT
A study on the influence of turn-on pulse width on double pulse testing for power semiconductor device
Research of IGBT failure energy transmission and energy shock
Intelligent integrated power device with high power density and research on its parallel application
Technology and application of high-voltage and large-capacity power semiconductor devices

Related Author

LIU Jie
XIE Shunmeng
QI Yu
ZHANG Wenliang
YU Wei
YANG Fei
CUI Lei
LIAO Chenwei

Related Institution

CRRC Zhuzhou Institute Co., Ltd.
Prime-rel Electronic Technology Co., Ltd.
Zhuzhou CRRC Times Semiconductor Co., Ltd.
Marching-Power Technology Group Co., Ltd.
State Key Laboratory of Power Semiconductor and Integration Technology
0