Research on solder layer void evolution mechanism for IGBT module of electric locomotive in service

LI Hanrui; LAI Wei; LI Hui; YAO Ran; YU Kai; AN Junpeng

doi:10.13890/j.issn.1000-128X.2022.05.107

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Research on solder layer void evolution mechanism for IGBT module of electric locomotive in service

High-power Devices | 更新时间：2024-08-02

- Research on solder layer void evolution mechanism for IGBT module of electric locomotive in service
- Electric drive for locomotives Issue 6, Pages: 138-148(2022)
- 作者机构：
  
  1.重庆大学电气工程学院，重庆　　400044
  2.中车永济电机有限公司，山西永济;044502
- 作者简介：
- 基金信息：
- DOI：10.13890/j.issn.1000-128X.2022.05.107
  CLC： TN325⁺.2;U264
- Published：10 November 2022，
  
  Received：07 December 2021，
  
  Revised：23 June 2022，
- 稿件说明：
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LI Hanrui, LAI Wei, LI Hui, et al. Research on solder layer void evolution mechanism for IGBT module of electric locomotive in service. [J]. Electric drive for locomotives (6):138-148(2022)
DOI：

LI Hanrui, LAI Wei, LI Hui, et al. Research on solder layer void evolution mechanism for IGBT module of electric locomotive in service. [J]. Electric drive for locomotives (6):138-148(2022) DOI： 10.13890/j.issn.1000-128X.2022.05.107.

摘要

牵引变流器作为电力机车关键部件，通过大功率绝缘栅双极型晶体管（Insulated Gate Bipolar Transistor，IGBT）实现直流能量与交流能量之间的转换，达到对交流牵引电动机启动、制动和调速的控制，其可靠性直接关系电力机车运行安全，而焊料层失效是IGBT模块主要失效模式之一，分析研究焊料层缺陷变化规律对IGBT模块可靠性至关重要。通过对电力机车服役前后的IGBT模块焊料层进行CT扫描，统计结果显示不同服役里程数的IGBT模块焊料层空洞数量服从泊松分布，并且泊松分布方差

https://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=63321724&type=

2.62466669

https://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=63321727&type=

1.77800000

值与器件服役里程数具有映射关系；基于空洞统计分布规律建立了计及初始缺陷的电力机车用IGBT模块多物理场仿真模型，从焊料层上下表面的应变数学描述研究了随机空洞的演化诱因与规律；基于能量的疲劳寿命模型得到了空洞分布、尺寸与演化速率的关系，为指导器件优化设计和主动运维提供支撑。

Abstract

As a key component of electric locomotives

the traction converter works for the DC to AC energy conversion through a large power insulated gate bipolar transistor (IGBT)

thus exerting control over starting

braking and speed regulation of the AC traction motor. Its reliability is directly related to the operational safety of electric locomotives. Since the solder layer failure is one of the main failure modes of IGBT modules

it is very important to clarify the solder layer defect evolution law

for the sake of reliability of IGBT modules. In this paper

the solder layer of an IGBT module was firstly scanned by CT before and after putting into service of the electric locomotive. The statistical results showed that the number of solder layer voids in the IGBT module with different service mileages was in line with the Poisson distribution

of which the variance (λ) had a mapping relationship with the service mileage of the devices. Secondly

a multi-physical field simulation model of IGBT modules for electric locomotives was established

based on the statistical distribution law of voids and considering the initial defects

and the evolution inducements and law of random voids were studied by means of the strain mathematical description on the upper and lower surfaces of the solder layer. Finally

the relationship among void distribution

size and evolution rate was generated according to the energy-based fatigue lifetime model

which provided a basis for guiding optimal design and active maintenance of the devices.

关键词

大功率IGBT模块空洞分布空洞演化多物理场有限元仿真电力机车

Keywords

high power IGBT modulevoid distributionvoid evolutionmulti-physical field finite element simulation electric locomotive

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