大功率半导体技术现状及其进展

刘国友; 王彦刚; 李想; SU Arthur; 李孔竞; 杨松霖

doi:10.13890/j.issn.1000-128x.2021.05.001

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大功率半导体技术现状及其进展

综述 | 更新时间：2021-12-13

- 大功率半导体技术现状及其进展
- High Power Semiconductor Technology Status and Progresses
- 机车电传动 2021年第5期页码：1-11
- 作者机构：
  
  1.新型功率半导体器件国家重点实验室，湖南　株洲　412001
  2.丹尼克斯半导体有限公司　功率半导体研发中心，英国　林肯　LN6　3LF
- 作者简介：
  
  刘国友（1966—），男，博士，教授级高级工程师，中车科学家，IEEE高级会员，长期从事功率半导体技术研究与产业化；E-mail: liugy@csrzic.com
  王彦刚（1974—），男，博士，教授级高级工程师，英国特许工程师，IEEE高级会员，主要从事大功率半导体器件设计、封装、工艺、可靠性等方面的研究开发工作；E-mail: yangang.wang@dynexsemi.com
- 基金信息：
- DOI：10.13890/j.issn.1000-128x.2021.05.001
  中图分类号：
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刘国友, 王彦刚, 李想, 等. 大功率半导体技术现状及其进展[J]. 机车电传动, 2021,(5):1-11.

Guoyou LIU, Yangang WANG, Xiang LI, et al. High Power Semiconductor Technology Status and Progresses[J]. Electric Drive for Locomotives, 2021,(5):1-11.
刘国友, 王彦刚, 李想, 等. 大功率半导体技术现状及其进展[J]. 机车电传动, 2021,(5):1-11. DOI： 10.13890/j.issn.1000-128x.2021.05.001.

Guoyou LIU, Yangang WANG, Xiang LI, et al. High Power Semiconductor Technology Status and Progresses[J]. Electric Drive for Locomotives, 2021,(5):1-11. DOI： 10.13890/j.issn.1000-128x.2021.05.001.

摘要

介绍了现代硅基大功率半导体器件的历史演变和新型器件结构的研究进展，以及宽禁带半导体材料和器件的现状；阐述了国内大功率半导体器件在轨道交通、直流输电和新能源汽车等领域的研发进展和应用现状；最后讨论了大功率半导体技术面临的技术挑战和发展趋势。

Abstract

The evolution of modern Si based high power semiconductor devices and recent progress of novel device structures,as well as the status of wide bandgap semiconductor materials and devices were presented in this paper. The development and application status of domestic high power semiconductor devices for rail transportation, DC transmission and new energy vehicles were introduced. Finally, the technology challenges and development trends of high power semiconductor technology were discussed.

关键词

功率半导体器件硅材料晶闸管门极可关断晶闸管集成门极换流晶闸管绝缘栅双极晶体管金属氧化物半导体场效应晶体管宽禁带

Keywords

power semiconductor deviceSi materialthyristorGTOIGCTIGBTMOSFETwide bandgap

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