A High-performance Double Side Cooled IGBT Module for EV/HEV Applications

Yaqing MA; Jun YU; Yuekang DU; Jianfeng LI

doi:10.13890/j.issn.1000-128x.2021.05.013

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A High-performance Double Side Cooled IGBT Module for EV/HEV Applications

Module Design and Packaging | 更新时间：2021-12-13

- A High-performance Double Side Cooled IGBT Module for EV/HEV Applications
- Electric Drive for Locomotives Issue 5, Pages: 87-92(2021)
- 作者机构：
  
  1.株洲中车时代电气股份有限公司　英国研发中心，英国　伯明翰　B37　7YE
- 作者简介：
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- DOI：10.13890/j.issn.1000-128x.2021.05.013
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Yaqing MA, Jun YU, Yuekang DU, et al. A High-performance Double Side Cooled IGBT Module for EV/HEV Applications. [J]. Electric Drive for Locomotives (5):87-92(2021)
DOI：

Yaqing MA, Jun YU, Yuekang DU, et al. A High-performance Double Side Cooled IGBT Module for EV/HEV Applications. [J]. Electric Drive for Locomotives (5):87-92(2021) DOI： 10.13890/j.issn.1000-128x.2021.05.013.

摘要

高性能、低成本和高可靠的电动汽车用集成功率模块是行业技术发展的方向。文章以双面冷却封装结构为核心，采用行业先进的封装技术，研制了一款高性能的双面冷却IGBT功率模块。从仿真和试验的数据来看，该IGBT模块具有优异的热性能和电气性能，同时具有明显改善的功率处理能力和足够的功率循环可靠性。

Abstract

High performance, low cost and high reliability integrated power modules for electric vehicle applications are leading the innovation in power electronic technology. In this paper, a high-performance double-sided cooling IGBT power module was developed based on the double-sided cooling packaging structure and the industry advanced packaging technology. From the simulation and test data, the IGBT module has excellent thermal and electrical performance, significantly improved power processing capacity and sufficient power cycle reliability.

关键词

IGBT模块电动汽车混合动力汽车集成式散热器双面冷却仿真

Keywords

IGBT power moduleEVHEVintegrated heat sinkdouble side cooling (DSC)simulation

references

SHIMOZUMA A, HAYASHI H, HIGUCHI S, et al. Packaging technology of power module for automotive applications[C]//IEEE. 2017 International Conference on Electronics Packaging (ICEP). Yamagata: IEEE, 2017. DOI: 10.23919/ICEP.2017.7939337http://doi.org/10.23919/ICEP.2017.7939337.

MOUAWAD B, ESPINA J, LI J, et al. Novel silicon carbide integrated power module for EV application[C]//IEEE. 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia). Xi'an: IEEE, 2019. DOI: 10.1109/WiPDAAsia.2018.8734672http://doi.org/10.1109/WiPDAAsia.2018.8734672.

YANG Y, DORN-GOMBA L, RODRIGUEZ R, et al. Automotive power module packaging: current status and future trends[J]. IEEE Access, 2020(8): 160126-160144. DOI: 10.1109/ACCESS.2020.3019775http://doi.org/10.1109/ACCESS.2020.3019775.

WINTRICH A, NICOLAI U, TURSKY W, et al. Application manual Power Semiconductors[M]. Nuremberg: SEMIKRON International Gmbh, 2011.

INFINEON. FS820R08A6P2B datasheet[EB/OL]. [2021-08-30]. https://www.infineon.com/dgdl/Infineon-HybridPACK_Automotive_Power_Modules_Explanation_of_Technical_Information-ApplicationNotes-v02_01-EN.pdf?fileId=5546d46272e49d2a017356d117763ef7https://www.infineon.com/dgdl/Infineon-HybridPACK_Automotive_Power_Modules_Explanation_of_Technical_Information-ApplicationNotes-v02_01-EN.pdf?fileId=5546d46272e49d2a017356d117763ef7.

盛永和, 科利诺. 电力电子模块设计与制造[M]. 北京: 机械工业出版社, 2016.

SHENG William W, COLINO Ronald P. Power electronic modules design and manufacture[J]. Beijing: China Machine Press, 2016.

JOHNSON C M, CASTELLAZZI A, SKURIAT R, et al. Integrated high power modules[C]//IEEE. 2012 7th International Conference on Integrated Power Electronics Systems (CIPS). Nuremberg: IEEE, 2012.

LI S, TOLBERT L M, WANG F, et al. Reduction of stray inductance in power electronic modules using basic switching cells[C]//IEEE. 2010 IEEE Energy Conversion Congress and Exposition. Atlanta: IEEE, 2010. DOI: 10.1109/ECCE.2010.5618040http://doi.org/10.1109/ECCE.2010.5618040.

CHOI U M, BLAABJERG F, JRGENSEN S. Power cycling test methods for reliability assessment of power device modules in respect to temperature stress[J]. IEEE Transactions on Power Electronics, 2017, 33(3): 2531-2551. DOI: 10.1109/TPEL.2017.2690500http://doi.org/10.1109/TPEL.2017.2690500.

DURAND C, KLINGLER M, COUTELLIER D, et al. Power cycling reliability of power module: a survey[J]. IEEE Transactions on Device and Materials Reliability, 2016, 16(1): 80-97. DOI: 10.1109/TDMR.2016.2516044http://doi.org/10.1109/TDMR.2016.2516044.

SYED A. Accumulated creep strain and energy density based thermal fatigue life prediction models for SnAgCu solder joints[C]//IEEE. 54th Electronic Components and Technology Conference. Las Vegas: IEEE, 2004. DOI: 10.1109/ECTC.2004.1319419http://doi.org/10.1109/ECTC.2004.1319419.

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